IEEE Transactions on Components, Packaging and Manufacturing TechnologyJournal EI
刊物类型:Journal
ISSN:21563950
EISSN:21563985
出版商:Institute of Electrical and Electronics Engineers Inc.
国家:United States
学科1:Electrical and Electronic Engineering
学科2:Industrial and Manufacturing Engineering
学科3:Electronic, Optical and Magnetic Materials
是否开放:-