Journal Title:Informacije Midem-journal Of Microelectronics Electronic Components And Material
Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material.
Topics of interest include:
Microelectronics,
Semiconductor devices,
Nanotechnology,
Electronic circuits and devices,
Electronic sensors and actuators,
Microelectromechanical systems (MEMS),
Medical electronics,
Bioelectronics,
Power electronics,
Embedded system electronics,
System control electronics,
Signal processing,
Microwave and millimetre-wave techniques,
Wireless and optical communications,
Antenna technology,
Optoelectronics,
Photovoltaics,
Ceramic materials for electronic devices,
Thick and thin film materials for electronic devices.
Informacije MIDEM 发表微电子、电子元件和材料领域的原创研究论文。审查论文仅应邀发表。需要更广泛读者的科学新颖性和潜在兴趣。鼓励作者提供尽可能多的细节,以便其他人能够复制他们的结果。因此,没有页数限制,只要文本简洁全面,任何不符合经典手稿的数据都可以作为补充材料添加。
感兴趣的话题包括:
微电子,
半导体器件,
纳米技术,
电子电路和设备,
电子传感器和执行器,
微机电系统 (MEMS),
医疗电子,
生物电子学,
电力电子,
嵌入式系统电子设备,
系统控制电子设备,
信号处理,
微波和毫米波技术,
无线和光通信,
天线技术,
光电子学,
光伏,
用于电子设备的陶瓷材料,
用于电子设备的厚薄膜材料。
大类学科 | 小类学科 | 分区 | Top期刊 | 综述期刊 |
工程技术 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 4区 | 是 | 是 |
大类学科 | 小类学科 | 分区 |
工程技术 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 4区 |
期刊名称 | 领域 | 中科院分区 | 影响因子 |
Applicable Algebra In Engineering Communication And Computing | 工程技术 | 4区 | 0.700 |
Revista Romana De Materiale-romanian Journal Of Materials | 工程技术 | 4区 | 0.700 |
Lasers In Engineering | 工程技术 | 4区 | 0.500 |
Science And Technology For The Built Environment | 工程技术 | 4区 | 1.900 |
Numerical Heat Transfer Part B-fundamentals | 工程技术 | 4区 | 1.000 |
Numerical Heat Transfer Part B-fundamentals | 工程技术 | 4区 | 1.000 |