Journal Title:Soldering & Surface Mount Technology
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
焊接和表面贴装技术力求在这一重要领域的知识和专业技术体系内为研究和应用的进步做出重要贡献。焊接和表面贴装技术补充其姊妹出版物;电路世界和微电子国际。
该杂志涵盖了从合金、焊膏和助焊剂到可靠性和环境影响的 SMT 的所有方面,目前正在为无铅焊料和工艺的新知识提供重要的传播途径。该杂志包括对用于组装最先进的功能性电子设备的关键材料和技术的多学科研究。重点是通过焊接组装设备和互连组件,同时还采用广泛的相关方法。
大类学科 | 小类学科 | 分区 | Top期刊 | 综述期刊 |
材料科学 | METALLURGY & METALLURGICAL ENGINEERING 冶金工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 ENGINEERING, MANUFACTURING 工程:制造 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 2区 | 是 | 是 |
大类学科 | 小类学科 | 分区 |
材料科学 | METALLURGY & METALLURGICAL ENGINEERING 冶金工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 ENGINEERING, MANUFACTURING 工程:制造 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 2区 |
期刊名称 | 领域 | 中科院分区 | 影响因子 |
Soldering & Surface Mount Technology | 材料科学 | 2区 | 2.000 |
Nano Convergence | 材料科学 | 2区 | 11.700 |
Nano Convergence | 材料科学 | 2区 | 11.700 |
Metallurgical And Materials Transactions A-physical Metallurgy And Materials Sci | 材料科学 | 2区 | 2.050 |
Journal Of Non-crystalline Solids | 材料科学 | 2区 | 3.500 |
Progress In Natural Science-materials International | 材料科学 | 2区 | 4.700 |